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SPECIFICATION FOR HIGH-PURITY TITANIUM SPUTTERING TARGET USED FOR THROUGH-SILICON VIAS (TSV) METALLIZATION
American Society for Testing and Materials
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Availability date: 11/06/2021
CONTAINED IN VOL. 10.04, 2016 Specifies the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.
Published | |
Document Type | Standard |
Status | Current |
Publisher | American Society for Testing and Materials |
Pages | |
ISBN | |
Committee | F 01 |