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ASTM F 3192 : 2016

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ASTM F 3192 : 2016

SPECIFICATION FOR HIGH-PURITY COPPER SPUTTERING TARGET USED FOR THROUGH-SILICON VIAS (TSV) METTALIZATION

American Society for Testing and Materials

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Abstract

CONTAINED IN VOL. 10.04, 2016 Specifies the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.

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Document Type Standard
Status Current
Publisher American Society for Testing and Materials
Committee F 01