M00020712
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PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
British Standards Institution
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Availability date: 11/05/2021
FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 General requirements<br>5 Through-hole mounting of components<br>6 Acceptance requirements<br>7 Rework of unsatisfactory solder connections<br>Annex A (normative) - Placement requirements for<br> through-hole mount devices<br>Bibliography<br>Annex ZA (normative) - Normative references to<br> international publications with their<br> corresponding European publications
Defines requirements for lead and hole solder assemblies.
Published | |
Document Type | Standard |
Status | Current |
Publisher | British Standards Institution |
Pages | |
ISBN | |
Committee | EPL/501 |
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