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BS IEC 62047‑31 : 2019
M00012702
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BS IEC 62047‑31 : 2019
Semiconductor devices. Micro-electromechanical devices. Four-point bending test method for interfacial adhesion energy of layered MEMS materials
British Standards Institution
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Abstract
This part of IEC 62047 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | British Standards Institution |
| ProductNote | THIS STANDARD IS ALSO IDENTICAL TO :IEC 62047‑31 |
| Committee | EPL/47 |