M00016476
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
British Standards Institution
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Availability date: 11/05/2021
FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Requirements<br>5 Testing method<br>Annex A (informative) - Dimensions for testing<br> structure and tensile/compressive strength<br>Annex B (informative) - Pull-press testing method<br> example<br>Annex ZA (normative) - Normative references to<br> international publications with their<br> corresponding European publications
Defines the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS).
Published | |
Document Type | Standard |
Status | Current |
Publisher | British Standards Institution |
Pages | |
ISBN | |
Committee | EPL/47 |
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