M00016806
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SURFACE CHEMICAL ANALYSIS - DEPTH PROFILING - METHOD FOR SPUTTER RATE DETERMINATION IN X-RAY PHOTOELECTRON SPECTROSCOPY, AUGER ELECTRON SPECTROSCOPY AND SECONDARY-ION MASS SPECTROMETRY SPUTTER DEPTH PROFILING USING SINGLE AND MULTI-LAYER THIN FILMS
British Standards Institution
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Availability date: 11/05/2021
Foreword<br>Introduction<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Requirement of single- and multi-layer reference<br> thin films<br>5 Determination of sputtering rate<br>Annex A (informative) - Report of international Round<br> Robin Test<br>Annex B (informative) - Prediction of the rates for a wide<br> range of other materials through tabulated values<br> of sputtering yields<br>Bibliography
Defines a method for the calibration of the sputtered depth of a material from a measurement of its sputtering rate under set sputtering conditions using a single- or multi-layer reference sample with layers of the same material as that requiring depth calibration.
Published | |
Document Type | Standard |
Status | Current |
Publisher | British Standards Institution |
Pages | |
ISBN | |
Committee | CII/60 |
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