Table of Contents

FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Grouping of soldering processes and related <br>&nbsp;&nbsp;&nbsp;test severities<br>5 Test equipment<br>6 Test Td[1]: Solderability of terminations<br>7 Test Td[2]: Resistance to soldering heat<br>8 Test Td[3]: Dewetting and resistance to dissolution of <br>&nbsp;&nbsp;&nbsp;metallization<br>9 Final measurements<br>10 Information to be given in the relevant specification<br>Annex A (normative) - Criteria for visual examination<br>Annex B (informative) - Guidance<br>Annex C (normative) - Application of the test methods to through <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;hole reflow soldering components (THR)<br>Annex X (informative) - Cross reference for references to the <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;prior revision of this specification<br>Bibliography<br>Annex ZA (normative) - Normative references to international <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;publications with their corresponding European <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;publications

Abstract

Gives procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

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Published
Document Type	Standard
Status	Current
Publisher	British Standards Institution
Pages
ISBN
Committee	EPL/501
Supersedes	01/201656 DC : DRAFT MAR 2001 BS 2011-2.1TD(1990) : 1990 97/200780 DC : JAN 97 11/30243259 DC : 0