Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms, definitions and abbreviations<br>4 Technical requirements<br>5 Plan administration requirements<br>Annex A (informative) - Requirement matrix for IEC TS<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;62239-1<br>Annex B (informative) - Typical qualification requirements<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;and typical component minimum qualification<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;requirements<br>Annex C (informative) - Semiconductor reliability and<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;wear out<br>Annex D (informative) - Guidelines for environmental<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;protection techniques and for comparison of<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;components specifications<br>Bibliography

Abstract

Specifies the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	British Standards Institution
Pages
ISBN
Committee	GEL/107
Supersedes	DD IEC TS 62239 : 2003