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SURFACE MOUNT TECHNOLOGY (SMT) REQUIREMENTS FOR EMBEDDED COMMUNICATION MODULES FOR MACHINE TO MACHINE COMMUNICATIONS
European Telecommunications Standards Institute
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Availability date: 11/06/2021
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Foreword
Modal verbs terminology
Introduction
1 Scope
2 References
3 Definitions and abbreviations
4 Physical Form Factor Specifications
5 Electrical Specifications
Annex A (informative) - Interfaces that may be provided
over General Purpose I/O (GPIO) or General
Purpose Pads (GPP)
Annex B (informative) - Design guidelines and
recommendations
Annex C (informative) - Bibliography
History
Defines the SMT pad layout and common interface assignments for essential pads including some general electrical characteristics.
Published | |
Document Type | Standard |
Status | Current |
Publisher | European Telecommunications Standards Institute |
Pages | |
ISBN | |
Committee | SMT |