M00030270
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Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
International Electrotechnical Committee
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Availability date: 11/05/2021
This part of IEC 63011 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC)to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Published | |
Document Type | Standard |
Status | Current |
Publisher | International Electrotechnical Committee |
Pages | |
ISBN | |
Committee | TC 47 |