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IEC 63011-2:2018
M00030275
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IEC 63011-2:2018
Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
International Electrotechnical Committee
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Abstract
This part of IEC 63011 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| ProductNote | THIS STANDARD ALSO REFERS TO IEC 63011-1, IEC 63011-3 |
| Committee | TC 47 |