Cart
0
Product
Products
(empty)
No products
To be determined
Shipping
$0.00
Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart.
There is 1 item in your cart.
Total products
Total shipping
To be determined
Total
New
Reduced price!
View larger
View larger
IEC 63011-1 ED1.0 B:2018
M00030277
New product
IEC 63011-1 ED1.0 B:2018
Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
International Electrotechnical Committee
In stock
More info
Abstract
This part of IEC 63011 provides definitions pertaining to multichip integrated circuits, asvertically stacked dies using through-silicon vias (TSVs) or micro bumps.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| ProductNote | THIS STANDARD ALSO REFERS TO IEC 63011-3 |
| Committee | TC 47 |