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IEC TS 62647-4 : 1ED 2018

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IEC TS 62647-4 : 1ED 2018

PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 4: BALL GRID ARRAY (BGA) RE-BALLING

International Electrotechnical Committee

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Abstract

Describes the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products.

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Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 107