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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
International Electrotechnical Committee
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Availability date: 11/05/2021
FOREWORD<br>INTRODUCTION<br>1 Scope <br>2 Normative references <br>3 Terms and definitions <br>4 Product categories and applications <br>5 Failure<br>6 Reliability test <br>7 Stress test methods<br>8 Supplementary tests <br>9 Summary table of assumptions <br>10 Summary<br>Bibliography
Provides guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs).
Published | |
Document Type | Standard |
Status | Current |
Publisher | International Electrotechnical Committee |
Pages | |
ISBN | |
Committee | TC 47 |