Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms, definitions and abbreviated terms<br>4 Storage requirements<br>5 Long-term storage failure mechanisms<br>6 LTS concerns, method, verification and limitations<br>7 Deterioration mechanisms specific to bare die<br>&nbsp;&nbsp;and wafers<br>8 Specific handling concerns<br>Annex A (informative) - Audit checklist<br>Bibliography

Abstract

Pertains to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 47