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IEC 62047-27 : 1ED 2017

M00030972

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IEC 62047-27 : 1ED 2017

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 27: BOND STRENGTH TEST FOR GLASS FRIT BONDED STRUCTURES USING MICRO-CHEVRON-TESTS (MCT)

International Electrotechnical Committee

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Table of Contents

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions, symbols and abbreviated terms
4 Principle
5 Test setup
6 Specimens
7 Conduction of the test
8 Test parameter
9 Analysis and evaluation
10 Test report
Bibliography

Abstract

Describes a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT).

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47