Table of Contents

FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Requirements<br>5 Testing method<br>Annex A (informative) - Dimensions for testing<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;structure and tensile/compressive strength<br>Annex B (informative) - Pull-press testing method<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;example

Abstract

Defines the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS).

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 47