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IEC 61189-3-719 : 1ED 2016
M00031304
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IEC 61189-3-719 : 1ED 2016
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
International Electrotechnical Committee
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Table of Contents
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test specimens
5 Test apparatus
6 Procedure
7 Report
8 Additional information
Bibliography
Abstract
Defines a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |