M00031466
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FIELD DEVICE INTEGRATION (FDI) - PART 4: FDI PACKAGES
International Electrotechnical Committee
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Availability date: 11/05/2021
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions, abbreviated terms and acronyms
4 FDI Package Model
5 FDI Package implementation
6 FDI Package Versioning
7 Digital Signatures and Registration Certificates
Annex A (normative) - File name conventions
Annex B (informative) - FDI Package creation
Annex C (informative) - FDI Package deployment
Annex D (informative) - Example
Annex E (normative) - Schema
Annex F (normative) - Communication protocol specific profiles
Annex G (informative) - FDI Package life-cycle use cases
Annex H (normative) - Health Status Method
Annex I (normative) - Modular devices
Annex J (normative) - FDI Communication Packages for FDI
Communication Server
Annex K (normative) - FDI Profile for EDDs
Bibliography
Defines the FDI Packages and it's overall architectural components.
Published | |
Document Type | Standard |
Status | Current |
Publisher | International Electrotechnical Committee |
Pages | |
ISBN | |
Committee | TC 65 |