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IEC 61189-5-4 : 1ED 2015

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IEC 61189-5-4 : 1ED 2015

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES

International Electrotechnical Committee

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Table of Contents

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
4 C: Chemical test methods
5 X: Miscellaneous test methods
Bibliography

Abstract

Specifies methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 91