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IEC 60748-21-1 : 2.0

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IEC 60748-21-1 : 2.0

SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR FILM INTEGRATED CIRCUITS AND HYBRID FILM INTEGRATED CIRCUITS ON THE BASIS OF QUALIFICATION APPROVAL PROCEDURES

International Electrotechnical Committee

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Table of Contents

INTRODUCTION
Clause
1. Characteristics and conditions of use
2. Recommended methods of mounting
3. Marking
4. Ordering information
5. Certified records of released lots
6. Additional information
7. Additional or increased severities or requirements
    to those specified in the generic and/or sectional
    specification
8. Inspection requirements (see tables 2 and 3 or 4
    and 5)
9. Supplement - Tables of method B
Tables
1. Where a range of circuits
2. Method A - Groups A and B - Lot-by-Lot
3a. Method A - Group C - Periodic tests
3b. Method A - Group D - Periodic tests
4a. Method B - Group A - Lot-by-Lot
4b. Method B - Group B - Lot-by-Lot
5a. Method B - Group C - Periodic tests
5b. Method B - Group D - Periodic tests

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47
Supersedes
  • IEC 748-21-1 : 1ED 91
  • IEC 60148B : 1979