Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Terms and definitions<br>3 Description of tape automated bonding (TAB)<br>4 Dimensional requirements<br>&nbsp;&nbsp;&nbsp;&nbsp;4.1 Film format<br>&nbsp;&nbsp;&nbsp;&nbsp;4.2 Alignment holes<br>&nbsp;&nbsp;&nbsp;&nbsp;4.3 Body size<br>&nbsp;&nbsp;&nbsp;&nbsp;4.4 Test pad patterns<br>&nbsp;&nbsp;&nbsp;&nbsp;4.5 Outer lead patterns<br>&nbsp;&nbsp;&nbsp;&nbsp;4.6 Maximum lead count<br>5 Variation codes<br>6 Requirements for inner and outer lead bonding (ILB and <br>&nbsp;&nbsp;&nbsp;&nbsp;OLB)<br>Figures<br>Tables<br>Notes to figures and tables<br>Annexes<br>A Summary of recommended TAB package configurations <br>&nbsp;&nbsp;&nbsp;&nbsp;(super format)<br>B Summary of recommended TAB package configurations<br>&nbsp;&nbsp;&nbsp;&nbsp;(wide format)<br>C Outer lead numbering<br>D Test pad numbering

Abstract

Provides recommendations applicable to integrated circuits in packages which use tape automated bonding (TAB) as the main component for structural and interconnection functions. Does not apply to the finished component supplied by a manufacturer to a user and does not specify requirements pertaining to the IC to tape interface (the inner lead bond or ILB).

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 47
Supersedes	IEC 191-5 : 1ED 87