Table of Contents

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Grouping of soldering processes and related
   test severities
5 Test equipment
6 Test Td[1]: Solderability of terminations
7 Test Td[2]: Resistance to soldering heat
8 Test Td[3]: Dewetting and resistance to dissolution
   of metallization
9 Final measurements
10 Information to be given in the relevant specification
Annex A (normative) - Criteria for visual examination
Annex B (informative) - Guidance
Annex C (normative) - Application of the test methods to through
        hole reflow soldering components (THR)
Annex X (informative) - Cross reference for references to the
        prior revision of this specification
Bibliography

Abstract

Gives procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91