Table of Contents

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the method
5 Description of the test apparatus
6 Preparation of specimens
7 Materials
8 Procedure
9 Presentation of results
10 Information to be given in the relevant specification
Annex A (normative) - Equipment specification
Annex B (informative) - Use of the wetting balance for
        SMD solderability testing
Annex C (normative) - Test methods for SMD components
        sizes 0603M (0201) or smaller
Annex D (informative) - Evaluation criteria - Guidance
Annex E (informative) - Method of calculating the
        maximum theoretical force and integrated value
        of the area of the wetting curve for leaded non-SMD
Bibliography

Abstract

Describes test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91