Table of Contents

FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test Ta: Solderability of wire and tag terminations
  4.1 Object and general description of the test
      4.1.1 Test methods
      4.1.2 Specimen preparation
      4.1.3 Initial measurements
      4.1.4 Accelerated ageing
  4.2 Method 1: Solder bath
      4.2.1 Description of the solder bath
      4.2.2 Flux
      4.2.3 Procedure
      4.2.4 Test conditions
      4.2.5 Final measurements and requirements
  4.3 Method 2: Soldering iron at 350 degrees C
      4.3.1 Description of soldering irons
      4.3.2 Solder and flux
      4.3.3 Procedure
      4.3.4 Final measurements and requirements
  4.4 Information to be given in the relevant specification
5 Test Tb: Resistance to soldering heat
  5.1 Object and general description of the test
      5.1.1 Test methods
      5.1.2 Initial measurements
  5.2 Method 1: Solder bath
      5.2.1 Description of the solder bath
      5.2.2 Flux
      5.2.3 Procedure
      5.2.4 Test conditions
      5.2.5 De-wetting
  5.3 Method 2: Soldering iron
      5.3.1 Description of soldering iron
      5.3.2 Solder and flux
      5.3.3 Procedure
  5.4 Recovery
  5.5 Final measurements and requirements
  5.6 De-wetting (if applicable)
  5.7 Information to be given in the relevant specification
Annex A (informative) Example of apparatus for accelerated
        steam ageing process
Annex B (normative) Specification for flux constituents
Bibliography

Abstract

Provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91