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IEC 60191-6-6 : 1.0

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IEC 60191-6-6 : 1.0

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA)

International Electrotechnical Committee

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Table of Contents

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
  3.1 flanged type
  3.2 type of real chip size
  3.3 FLGA
  3.4 material designation
      3.4.1 plastic type (P-FLGA)
      3.4.2 ceramic type (C-FLGA)

Abstract

Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee SC 47D