Table of Contents

Foreword<br>Introduction<br>1 Scope<br>2 Normative references<br>3 General<br>4 Capability approval and maintenance of capability<br>&nbsp;&nbsp;&nbsp;&nbsp;approval <br>5 Test specimens<br>6 Test sequence<br>7 Quality assessment<br>8 Customer detail specification (CDS) data<br>9 Characteristics of printed boards<br>10 Capability test programme<br>11 Quality conformance inspection<br>12 Test specimens<br>Figures<br>1 Resin smear at interface<br>2 Circumferential defects<br>3 Conductor pattern defects<br>4 Minimum annular width (W1) of external land<br>5 Minimum annular width (W2) of internal land<br>6 Hole break-out<br>7 Examples of soldered holes<br>Annexes <br>A Acronyms related to IECQ and their explanations<br>B Conversion table<br>C Bibliography

Abstract

Applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 52