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IEC 60191-6-3 : 1.0

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IEC 60191-6-3 : 1.0

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)

International Electrotechnical Committee

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Table of Contents

FOREWORD
1 Scope
2 Normative references
3 Definitions
4 Measuring methods

Abstract

A method is stipulated for quad flat packs (QFP) measuring dimensions which are classified into Form E.

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Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47