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IEC 60191-1 : 3.0

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IEC 60191-1 : 3.0

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES

International Electrotechnical Committee

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Table of Contents

FOREWORD<br>1 Scope <br>2 Normative references <br>3 Terms and definitions <br>4 General rules for all drawings <br>5 Additional rules <br>6 Inter-conversion of inch and millimetre dimensions and<br>&nbsp;&nbsp;rules for rounding off<br>7 Rules for coding <br>Annex A (informative) - Reference letter symbols<br>Annex B (informative) - Rules to specify the dimensions and<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;positions of terminals on a base drawing<br>Annex C (normative) - General philosophy of flat base devices <br>Annex D (normative) - Special rules for SMD-packages<br>Annex E (informative) - Examples of semiconductor device drawings<br>Annex F (informative) - Former rules for rounding off<br>Annex G (informative) - Former rules for coding<br>Bibliography

Abstract

Gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47