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IEC 61189-3 : 2.0

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IEC 61189-3 : 2.0

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)

International Electrotechnical Committee

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Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope and object<br>2 Normative references<br>3 Accuracy, precision and resolution<br>4 Catalogue of approved test methods <br>5 P: Preparation/conditioning test methods<br>6 V: Visual test methods <br>7 D: Dimensional test methods<br>8 C: Chemical test methods <br>9 M: Mechanical test methods<br>10 E: Electrical test methods <br>11 N: Environmental test methods <br>12 X: Miscellaneous test methods<br>Annex A (informative) Worked examples

Abstract

Specifies test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

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Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 91