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IEC 61191-3 : 2.0

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IEC 61191-3 : 2.0

PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES

International Electrotechnical Committee

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Table of Contents

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Through-hole mounting of components
6 Acceptance requirements
7 Rework of unsatisfactory solder connections
Annex A (normative) - Placement requirements for
        through-hole mount devices
Bibliography

Abstract

Gives requirements for lead and hole solder assemblies.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 91