M00036659
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS) - TRANSFER ADHESIVE FILMS
International Electrotechnical Committee
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Availability date: 11/06/2021
FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Designation
6 Properties of adhesive films
7 Dimensions and tolerances
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
reference numbers
Gives requirements for transfer adhesive films for use in the fabrication of flexible multi-layer boards or flex-rigid printed boards.
Published | |
Document Type | Standard |
Status | Current |
Publisher | International Electrotechnical Committee |
Pages | |
ISBN | |
Committee | TC 52 |