Table of Contents

1 Overview
2 Scope
3 Purpose
4 References
5 Terminology
  5.1 Performance level
  5.2 Sheltered applications
  5.3 Performance level qualification
  5.4 Normal operation
  5.5 Module
  5.6 Component
  5.7 Maximum power
  5.8 Mounting
  5.9 Test duration
  5.10 Initial and final measurements
  5.11 Relevant specification
6 Nonoperating environmental conditions
  6.1 Low temperature (nonoperating/storage)
  6.2 High temperature (nonoperating/storage)
  6.3 Thermal shock (nonoperating/storage)
  6.4 Humidity (nonoperating/storage)
  6.5 Shock (nonoperating/storage)
  6.6 Salt fog corrosion (nonoperating/storage)
  6.7 Mixed flowing gas corrosion (nonoperating/storage)
  6.8 Fungus (nonoperating/storage)
  6.9 Flammability
  6.10 Electrostatic discharge (ESD) (nonoperating/storage)
7 Operating environmental conditions
  7.1 Low temperature (operating)
  7.2 High temperature (operating)
  7.3 Sinusoidal vibration (operating)
  7.4 Random vibration (operating)
  7.5 Shock (operating)
  7.6 Low air pressure (operating)
  7.7 Electrostatic discharge (ESD) (operating)
  7.8 Electromagnetic interference (EMI) (operating)
  7.9 Life test (operating)
8 Test sequence
  8.1 Testing after failure
  8.2 Module changes
  8.3 Test groups
Annex A (informative) Shock and vibration fixtures
Annex B (informative) Thermal testing of forced convection-cooled
                      modules

Abstract

Contains the minimum environmental withstand conditions that are applicable to computer modules/circuit boards and all of the components attached to those modules. Provides general environmental withstand conditions for one or more of the previously listed computer buses or interconnect standards. Also applicable to electronic equipment in general. Purpose is to provide a common set of specifications for physical integrity and environmental performance levels for computer modules and their components.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	Institute of Electrical & Electronics Engineers
Pages
ISBN
Supersedes	IEEE DRAFT 1156.1 : DRAFT 2.2