M00022694
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SURFACE CHEMICAL ANALYSIS - DEPTH PROFILING - METHOD FOR SPUTTER RATE DETERMINATION IN X-RAY PHOTOELECTRON SPECTROSCOPY, AUGER ELECTRON SPECTROSCOPY AND SECONDARY-ION MASS SPECTROMETRY SPUTTER DEPTH PROFILING USING SINGLE AND MULTI-LAYER THIN FILMS
International Organization for Standardization
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Availability date: 11/05/2021
Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Requirement of single- and multi-layer reference
thin films
5 Determination of sputtering rate
Annex A (informative) - Report of international Round
Robin Test
Annex B (informative) - Prediction of the rates for a wide
range of other materials through tabulated values
of sputtering yields
Bibliography
Defines a method for the calibration of the sputtered depth of a material from a measurement of its sputtering rate under set sputtering conditions using a single- or multi-layer reference sample with layers of the same material as that requiring depth calibration.
Published | |
Document Type | Standard |
Status | Current |
Publisher | International Organization for Standardization |
Pages | |
ISBN | |
Committee | TC 201 |
Supersedes |
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