M00026793
New product
EVALUATION OF THICKNESS, DENSITY AND INTERFACE WIDTH OF THIN FILMS BY X-RAY REFLECTOMETRY - INSTRUMENTAL REQUIREMENTS, ALIGNMENT AND POSITIONING, DATA COLLECTION, DATA ANALYSIS AND REPORTING
International Organization for Standardization
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Availability date: 11/05/2021
Foreword
Introduction
1 Scope
2 Terms, definitions, symbols and abbreviated terms
3 Instrumental requirements, alignment and
positioning guidelines
4 Data collection and storage
5 Data analysis
6 Information required when reporting XRR analysis
Annex A (informative) - Example of report for an
oxynitrided silicon wafer
Bibliography
Describes a method for the evaluation of thickness, density and interface width of single layer and multilayered thin films which have thicknesses between approximately 1 nm and 1 [mu]m, on flat substrates, by means of X-Ray Reflectometry (XRR).
Published | |
Document Type | Standard |
Status | Current |
Publisher | International Organization for Standardization |
Pages | |
ISBN | |
Committee | TC 201 |
Supersedes |
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