Table of Contents

Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) - Comparison between alloy numbers
        in ISO 9453 and short names and chemical
        compositions according to IEC 61190-1-3
Annex B (informative) - Patented alloys and patent holder list
Bibliography

Abstract

Defines the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Organization for Standardization
Pages
ISBN
Committee	TC 44
Supersedes	ISO/DIS 9453 : 60.00 (2014)