Table of Contents

Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Test methods
Annex A (normative) - Characteristics evaluation table of
solder paste
Annex JA (informative) - Comparison table between JIS
and corresponding International Standard

Abstract

Describes the shape, surface condition judgment test and particle size distribution measurement test of the solder particles of solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	Japanese Standards Association
ProductNote	Supersedes JIS Z3284. (06/2014)
Pages
ISBN
Supersedes	JIS Z 3284:1994