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JIS Z 3284-4:2014

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JIS Z 3284-4:2014

Solder Paste - Part 4: Test Methods For Wettability, Solderball And Spread

Japanese Standards Association

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Table of Contents

Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Test methods
Annex A (normative) - Characteristics evaluation table of
solder paste
Annex JA (informative) - Comparison table between JIS
and corresponding International Standard

Abstract

Defines the flux efficacy and de-wetting test, solderball test, spread test, wetting balance test and displacement detection wetting test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.

General Product Information

Document Type Standard
Status Current
Publisher Japanese Standards Association
ProductNote Supersedes JIS Z3284. (06/2014)
Supersedes
  • JIS Z 3284:1994