Table of Contents

1 Introduction
1.1 Reference ambient conditions
1.2 Devices without heat-dissipation
1.3 Devices with heat-dissipation
1.4 Ambient temperature
1.5 Surface temperatures
2 Reasons for the differing test procedures
2.1 Mechanisms of heat transfer
3 Test chambers
3.1 General
3.2 Methods of achieving the required conditions in the
test chamber
4 Measurements
4.1 Temperature
4.2 Air velocity
4.3 Emissivity coefficient
5 Precautions on tests
5.1 Overstress
5.2 Testing precautions
Appendix A Effects of size of chamber on surface temperature
of a specimen when no forced air circulation is used
Appendix B Effect of airflow on chamber conditions and on
surface temperatures of test specimens
Appendix C Effect of specimen emissivity coefficient in
temperature rise
Appendix D Effect of wire termination dimensions and material
on surface temperature of a component
Appendix E Heat transfer calculations and nomograms
Appendix F Thermal conductivities of common materials
Appendix G Measurement of temperature
Appendix H Measurement of air velocity
Appendix J Measurement of emissivity coefficient
Appendix K general block diagram, cold and dry heat tests

Abstract

The performance of components and equipments is influenced and limited by their internal temperatures which depend on the external ambient conditions and on the heat generated within the device itself.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	Japanese Standards Association
Pages
ISBN
Supersedes	JIS C 60068-3-1:1995