Table of Contents

Introduction
Section 1 - Scope
1 Scope
Section 2 - General
2 General
2.1 Normative references
2.2 Units, symbols and terminology
2.3 Preferred values
2.4 Marking
Section Three - Quality assessment procedures
3 Quality assessment procedures
3.1 Qualification approval/quality assessment systems
3.2 Primary stage of manufacture
3.3 Structurally similar components
3.4 Qualification approval procedures
3.5 Quality conformance inspection
3.6 Alternative test methods
3.7 Unspecified parameters
Section Four - Test and measurement procedures
4 Procedures of test and measurement
4.1 General
4.2 Standard atmospheric conditions
4.3 Drying
4.4 Visual examination and check of dimensions
4.5 Continuity (except for continuously rotating
potentiometers)
4.6 Element resistance
4.7 Terminal resistance (Minimum resistance)
4.8 Maximum attenuation [Alternave (when specified)
to terminal resistance]
4.9 Resistance law
4.10 Matching of the resistance law (for ganged
potentiometers only)
4.11 Switch contact resistance (when applicable)
4.12 Voltage proof
4.13 Insulation resistance
4.14 Variation of resistance with temperature
4.15 Rotational noise
4.16 Contact resistance at low-voltage levels
4.17 Setting ability (adjustability)
4.18 Starting torque
4.19 Switch torque
4.20 End stop torque
4.21 Locking torque
4.22 Thrust and pull on spindle
4.23 Spindle run-out
4.24 Lateral run-out
4.25 Spigot diameter run-out
4.26 Spindle end play
4.27 Backlash
4.28 Dither
4.29 Output smoothness
4.30 Robustness of terminations
4.31 Sealing
4.32 Solderability (In case of surface mounting,
the provision of 4.50 shall be applied)
4.33 Resistance to soldering heat (In case of surface
mounting, the provision of 4.51 shall be applied)
4.34 Change of temperature
4.35 Vibration (Sinusoidal)
4.36 Bump
4.37 Shock
4.38 Climatic sequence
4.39 Damp heat (steady state)
4.40 Mechanical endurance
4.41 A.C. endurance testing of mains switches on
capacitive loads
4.42 D.C. endurance testing of switches
4.43 Electrical endurance
4.44 Component solvent resistance
4.45 Solvent resistance of the marking
4.46 Microlinearity
4.47 Mounting (Applicable only for surface mounting semi
fixed potentiometer)
4.48 Adhesion (Applicable only for surface mounting
semi fixed potentiometer)
4.49 Bond strength of the face plating (Applicable only
for surface mount semi fixed potentiometer)
4.50 Solderability (Applicable only for surface mount
fixed potentiometer)
4.51 Resistance to soldering heat (Applicable only to
surface mount semi fixed potentiometer)
Annex A (normative) Rules for the preparation of detail
specifications for capacitors and resistors for electronic
equipment
Annex B (normative) Interpretation of sampling plans and
procedures as described in IEC 60410 for use within the IEC
Quality Assessment System for electronic components
Annex C (normative) A suitable method for measuring
rotational noise
Annex D (normative) Apparatus for measuring mechanical
accuracy
Annex E (normative) Measuring method for microlinearity
Annex 1 (normative) Type designation and marking
Annex 2 (normative) Recommended dimensions of spindle and
mounting part of potentiometer

Abstract

Defines the potentiometers to be used in electronic equipment (known as potentiometers). Defines terms inspection and test methods to be used in sectional and detail specifications for qualification approval and quality assessment systems. Refers to single rotary potentiometer having a control spindle.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	Japanese Standards Association
ProductNote	Supersedes JIS C5261. (09/2000) Supersedes JIS C5260. (04/2016)
Pages
ISBN
Supersedes	JIS C 5260-1:1999 JIS C 5260:1996