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JIS C 5630-13:2014
M00058058
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JIS C 5630-13:2014
Semiconductor Devices - Micro-electromechanical Devices - Part 13: Bend-and Shear-type Test Methods Of Measuring Adhesive Strength For Mems Structures
Japanese Standards Association
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General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | Japanese Standards Association |