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JIS Z 3198-6:2003
M00062927
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JIS Z 3198-6:2003
Test methods for lead-free solders Part 6: Methods for 45°pull test of solder joints on QFP lead
Japanese Standards Association
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Table of Contents
Abstract
This Standard specifies methods for 45 deg. pull test of solder joints on QFP lead to be used principally for wiring connection, components connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | Japanese Standards Association |