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JIS Z 3198-4:2003
M00062932
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JIS Z 3198-4:2003
Test methods for lead-free solders Part 4: Methods for solderbility test by a wetting balance method and a contact angle method
Japanese Standards Association
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Abstract
This Standard specifies the methods for solderability test of a wetting balance method and a contact angle method of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | Japanese Standards Association |