M00063029
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Test methods for lead-free solders Part 7: Methods for shear strength of solder joints on chip components
Japanese Standards Association
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Availability date: 11/08/2021
This Standard specifies test methods for shear strength of solder joints on chip components by using lead-free solder to be used principally for wiring connection of electrical machining and apparatus, electronic apparatus, communication equipment or the like, wiring connection of components and the like.
Published | |
Document Type | Standard |
Status | Current |
Publisher | Japanese Standards Association |
Pages | |
ISBN |