M00064761
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Copper-clad laminates for printed wiring boards - Paper base, epoxy resin
Japanese Standards Association
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Availability date: 11/08/2021
This Japanese Industrial Standard specifies the copper-clad laminates for printed wiring boards using paper base, epoxy resin (hereafter referred to as "copper-clad laminates").
Published | |
Document Type | Standard |
Status | Current |
Publisher | Japanese Standards Association |
Pages | |
ISBN |